![]() ![]() Seconds after the complete reflow of the tin lead plating in the through hole, bubbles will be seen emanating from any thin or porous area in the through plating.The hole should be examined simultaneously during application of the soldering iron. The tip temperature can be varied, but 500☏ is normally satisfactory. The easiest way to do this is to apply a fine-tipped soldering iron to the pad area on the board or to a track connecting to the pad area. This also locally heats the surrounding board area. Next, reflow the solder in the plated through holes.For general examination, 5X magnification will allow viewing of bubble formation for a more detailed examination of the through hole, 25X magnification should be used. ![]() A suitable optical viewing aid will be required to examine the hole during test. A simple light box or illuminated bottom stage on a microscope may provide suitable lighting.
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